No. | Item | Capability |
1 | No. of Layer | 1－22Layer |
2 | Finished Board Size | max23″×47″（584mm×1200mm）
min3.0″×2.0″(76mm×51mm) |
3 | Material | CEM-3,FR-4(Normal to High TG)，Rogers, PTFE, FR-5, CEM-1, FR-1. |
4 | Board Thickness | 0.016″ (0.4mm)-0.126″(3.2mm) |
5 | Copper Thickness | 1/3OZ-8OZ |
6 | Surface Finish | HAL,ENIG,OSP,FLASH GOLD, GOLD FINGER,IMMERSION SILVER/TIN |
7 | Drilling Hole Diameter（Min） | ф0.004″ (0.10mm) |
8 | Drilling precision | ±3mil ( ±0.076mm) |
9 | Hole Diameter Tolerance | PTH±3mil ( ±0.076mm) NPTH±2mil ( ±0.051mm) |
10 | Outline Tolerance | +/-4mil（0.1mm） |
11 | Design Line Width/Space of Outer Layer (Min)
| 3mil (0.076mm) |
12 | Design Line Width/Space of Inner Layer (Min)
| 3mil (0.076mm) |
13 | Outer layer contraposition precision | ±2mil ( ±0.051mm) |
14 | SM contraposition precision | ±2mil ( ±0.051mm) |
15 | Molding precision | ±4mil (± 0.1mm) |
16 | Impedance Control Tolerance | +/-10% |
17 | Peelable Soldermask Thickness | ≥0.2mm |
18 | Aspect Ratio | 12:1 |
19 | Layer Misregistration | +/-4mil |
